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Post by : Meena Ariff
Micron Technology is set to significantly boost its presence in Japan, announcing an investment of 1.5 trillion yen (around $9.6 billion) to construct a new semiconductor facility in Hiroshima. This plant will specialize in the production of next-generation high-bandwidth memory (HBM) chips, as revealed by sources close to the project.
Construction is slated to kick off in May next year at Micron's existing Hiroshima location, with the aim of commencing commercial shipments by 2028. The Japanese Ministry of Economy, Trade and Industry is reportedly ready to offer up to 500 billion yen in financial support for the initiative, aligning with efforts to revitalize the country's chip industry.
Japan has been actively revitalizing its semiconductor sector through substantial grants to international manufacturers. In addition to supporting Micron, the government is also providing assistance to firms like TSMC and helping fund the establishment of a new production facility for advanced logic chips utilizing IBM technology.
The rising demand for HBM chips is primarily driven by advancements in artificial intelligence, cloud technologies, and vast data centers. By enhancing its operations in Hiroshima, Micron seeks to lessen its dependence on Taiwanese manufacturing and bolster its competitive stance against other leading memory chip makers, such as SK Hynix.
The new facility is expected to strengthen Japan's role in the rapidly expanding high-performance memory market while promoting diversification in global supply chains.
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